Cambodia, U.S. Sign MoU on Patent Cooperation

Cambodia and the United States of America have reached a cooperation agreement on acceleration of patent processing.

The agreement was inked recently through a virtual event co-led by H.E. Cham Prasidh, Senior Minister and Minister of Industry, Science, Technology and Innovation and H.E. Andrei Iancu, Director of United States Patent and Trademark Office (USPTO) in Washington, D.C. under the witness of H.E. Patrick Murphy, U.S. Ambassador to Cambodia.

Both sides spoke highly of the joint effort to reach the agreement expected to attract more U.S. investors to Cambodia.

Speaking on the occasion, H.E. Patrick Murphy underlined the long-lasting relations between Cambodia and the U.S., adding that this year is the 70th anniversary of diplomatic relations between the two countries.

The virtual event is another move to further boost Cambodia’s economic growth and the confidence of U.S. investors to come to Cambodia, continued the U.S. diplomat.

The U.S. side will circulate this cooperation via the website and other channels to reach the potential U.S. investors.

By far, the Ministry of Industry, Science, Technology and Innovation has secured such patent cooperation with countries and bloc such as Singapore, Japan, South Korea, China and European Union.

Source: Agency Kampuchea Press